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Plasma ALD Equipment - List of Manufacturers, Suppliers, Companies and Products

Plasma ALD Equipment Product List

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Creative Coatings "Vapor Technology"

We will introduce the technologies and processing examples we propose based on the work material, film type, and film thickness!

"Vapor phase technology" is utilized in various fields such as 'new materials and substances' and 'energy' including resin raw materials and fuel cells, as well as in 'medical and healthcare' applications like medical sensors and devices, and in 'mobile devices', 'wearable devices', and 'automotive' sectors including electronic components and new displays. Additionally, it achieves film formation in the range of 1nm to 1000nm with diverse processes, film thicknesses, and types. Coating is performed using deposition methods such as evaporation, CVD, ALD, and sputtering. 【Features】 ■ ALD Robot CVA series Enables high-quality film formation at low temperatures, which is considered difficult in ALD. ■ Barrel-type ALD Robot CVA-B series A fusion of low-temperature ALD equipment and barrel mechanism. ■ Low-temperature high-frequency excitation DLC film formation device CVC series Allows for good adhesion film formation from graphite to DLC at low temperatures. ■ Bubbling CVD Robot CVB series Liquid to gas Enables low-cost and high-quality film formation at low temperatures. ■ IBAD (Ion Beam Assisted Deposition) CVI series Examples of contract film formation using IBAD Allows for low-energy irradiation at low temperatures, improving the adhesion of transparent conductive films (Zn O) and high-melting-point metal electrode formation for touch panels.

  • Contract manufacturing

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Load-lock type plasma ALD system "AD-230LP"

Alternately supply organometallic materials and oxidants to the reaction chamber, and film formation occurs only through surface reactions.

The "AD-230LP" is an ALD device capable of atomic-level film thickness control. It supplies organic metal precursors and oxidizers alternately to the reaction chamber, forming a film solely through surface reactions. With a load-lock chamber, it does not expose the reaction chamber to the atmosphere, allowing for highly reproducible film formation. Additionally, by adopting a capacitively coupled plasma (CCP) method, it minimizes the volume of the reaction chamber, shortens gas purge times, and accelerates each cycle. 【Features】 - Conformal film formation at the top, middle, and bottom - Uniform layer control at the atomic monolayer level - Conformal film formation possible for high aspect ratio structures - Excellent in-plane uniformity and reproducibility, achieving a stable process - Unique reaction chamber structure suppresses particles *For more details, please refer to the PDF document or feel free to contact us.

  • Other physicochemical equipment

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